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PLCC or PQFP to PGA Adapter

Interconnect Systems Inc.


Architecture:
Type :
Last Update:

i960(R) Processors JX
Hardware Accessories
6/26/97 11:30:00 AM

Vendor Information


Tool Description:

Interconnect Systems, Inc. has an adapter for converting a surface mount package to a through-hole (PGA) package. The i960(R) processor adapter allows the user to use the surface mount package without forcing direct fine-pitch surface mount on a large board assembly, and without any board re-design whatsoever. This is because ISI has developed an adapter design which allows existing package footprints to directly translate to each other.

Tool Features:

  • Installed Cost Savings Using Adapter Plus PQFP, Versus PGA - Makes Intel Chip Cost Effective For Thru-Hole Users

  • Adapter Plus PQFP Form and Function Compatible With Intel PGA - Use Adapter Without Any Board Design Modifications

  • Flexibility in Package Use - Allows Chip Users to Convert Between Different Package Styles Without Board Modification

  • Capability of Adapters to Provide Custom Features to Specific Chip Users - Add Power/Ground Planes, De-Coupling Capacitors, Multiple Chips, etc. While Maintain Package Footprint Compatibility

    • Development Platform(s):

    File Attachments:

    S960_158.PDF - Solutions960(R) Catalog Product Listing

    Supported Device Detail Matrix:

    		Part & Package

    		Availability

    		80960JA - 132ldPGA
    80960JA - 132ldPQFP
    80960JD - 132ldPGA
    80960JD - 132ldPQFP
    80960JF - 132ldPGA
    80960JF - 132ldPQFP
    80L960JA - 132ldPQFP
    80L960JA - 168ldPGA
    80L960JF - 132ldPQFP
    80L960JF - 168ldPLCC

    		NOW
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    Vendor Information:


    Interconnect Systems Inc.

    2162 Union Place, P.O. Box 1089
    Simi Valley , CA 93065
    USA
    (805) 581-5626

    Fax : (805) 581-5032

    Contact the vendor above for the latest Distributor information



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